POM MFI8 CELCON

Nombre del producto: POM – MFI8 – ENTEC – CELCON M90
Categoría: Etileno Acetato de Vinilo
Información del manual del producto: CELCON® M90
CELCON®
Celcon® acetal copolymer grade M90 is a medium viscosity polymer providing optimum performance in injection molding
and extrusion of thin walled tubing and thin gauge film. This grade provides overall excellent performance in many
applications. Chemical abbreviation according to ISO 1043-1: POM Please also see Hostaform® C 9021.
Product information
Resin Identification
POM
ISO 1043
Part Marking Code
>POM< ISO 11469 Rheological properties Melt volume-flow rate 8 cm³/10min ISO 1133 Temperature 190 °C Load 2.16 kg Melt mass-flow rate 9 g/10min ISO 1133 Melt mass-flow rate, Temperature 190 °C Melt mass-flow rate, Load 2.16 kg Moulding shrinkage, parallel 2.0 % ISO 294-4, 2577 Moulding shrinkage, normal 1.9 % ISO 294-4, 2577 Typical mechanical properties Tensile modulus 2760 MPa ISO 527-1/-2 Tensile stress at yield, 50mm/min 65 MPa ISO 527-1/-2 Tensile strain at yield, 50mm/min 10 % ISO 527-1/-2 Flexural modulus 2550 MPa ISO 178 Flexural stress at 3.5% 73 MPa ISO 178 Compressive stress at 1% strain 31 MPa ISO 604 Tensile creep modulus, 1h 2450 MPa ISO 899-1 Tensile creep modulus, 1000h 1350 MPa ISO 899-1 Charpy impact strength, 23°C 188 kJ/m² ISO 179/1eU Charpy impact strength, -30°C 181 kJ/m² ISO 179/1eU Charpy notched impact strength, 23°C 6 kJ/m² ISO 179/1eA Charpy notched impact strength, -30°C 6 kJ/m² ISO 179/1eA Izod notched impact strength, 23°C 5.7 kJ/m² ISO 180/1A Izod notched impact strength, -30°C 5.5 kJ/m² ISO 180/1A Izod impact strength, 23°C 107 kJ/m² ISO 180/1U Izod impact strength, -40°C 5 kJ/m² ISO 180/1U Poisson's ratio 0.4 Thermal properties Melting temperature, 10°C/min 166 °C ISO 11357-1/-3 Temperature of deflection under load, 1.8 MPa 101 °C ISO 75-1/-2 Temperature of deflection under load, 0.45 MPa 158 °C ISO 75-1/-2 Ball pressure test 150 °C IEC 60695-10-2 Coefficient of linear thermal expansion (CLTE), parallel 120 E-6/K ISO 11359-1/-2 Coefficient of linear thermal expansion (CLTE), normal 120 E-6/K ISO 11359-1/-2 Thermal conductivity of melt 0.155 W/(m K) ISO 22007-2 Effective thermal diffusivity, flow 4.85E-8 m²/s ISO 22007-4 Printed: 2025-02-13 Page: 1 of 15 Revised: 2024-10-23 Source: Celanese Materials Database CELCON® M90 CELCON® Specific heat capacity of melt 2210 J/(kg K) ISO 22007-4 Flammability Burning Behav. at 1.5mm nom. thickn. HB class IEC 60695-11-10 Thickness tested 1.5 mm IEC 60695-11-10 UL recognition yes UL 94 Oxygen index 14.9 % ISO 4589-1/-2 FMVSS Class B ISO 3795 (FMVSS 302) Burning rate, Thickness 1 mm 36 mm/min ISO 3795 (FMVSS 302) Electrical properties Volume resistivity 8E12 Ohm.m IEC 62631-3-1 Surface resistivity 3E16 Ohm IEC 62631-3-2 Arc Resistance 240 s UL 746B Physical/Other properties Humidity absorption, 2mm 0.2 % Sim. to ISO 62 Water absorption, 2mm 0.75 % Sim. to ISO 62 Density 1410 kg/m³ ISO 1183 Injection Drying Recommended no Drying Temperature 100 °C Drying Time, Dehumidified Dryer 3 - 4 h Processing Moisture Content ≤0.2 % Melt Temperature Optimum 185 °C Min. melt temperature 180 °C Max. melt temperature 190 °C Screw tangential speed ≤0.3 m/s Mold Temperature Optimum 100 °C Min. mould temperature 80 °C Max. mould temperature 120 °C Hold pressure range 60 - 120 MPa Back pressure 4 MPa Ejection temperature 130 °C Characteristics Processing Injection Moulding, Film Extrusion, Extrusion, Sheet Extrusion, Other Extrusion, Blow Moulding, Calendering, Compression moulding Delivery form Pellets Additional information Injection molding Preprocessing Drying is generally not required because Celcon® and Hostaform® acetal copolymers are not hydroscopic nor are they degraded by moisture during processing. Excessive moisture can lead to splay (silver streaking) in molded Printed: 2025-02-13 Page: 2 of 15 Revised: 2024-10-23 Source: Celanese Materials Database CELCON® M90 CELCON® parts. For better uniformity in molding especially when using regrind or material that has been stored in containers open to the atmosphere, recommended drying conditions are 80 C (180 F) for 3hours. Desiccant hopper dryers are not required. Maximum water content = 0.35% Processing Standard reciprocating screw injection molding machines with a high compression screw (minimum 3:1 and preferably 4:1) and low back pressure (0.35 Mpa/50 PSI) are favored. Using a low compression screw (I.E. general purpose 2:1 compression ratio) can result in unmelted particles and poor melt homogeneity. Using a high back pressure to make up for a low compression ratio may lead to excessive shear heating and deterioration of the material. Melt Temperature: Preferred range 182-199 C (360-390 F). Melt temperature should never exceed 230 C (450 F). Mold Surface Temperature: Preferred range 82-93 C (180-200 F) especially with wall thickness less than 1.5 mm (0.060 in.). May require mold temperature as high as 120 C (250 F) to reproduce mold surface or to assure minimal molded in stress. Wall thickness greater than 3mm (1/8 in.) may use a cooler (65 C/150 F) mold surface temperature and wall thickness over 6mm (1/4 in.) may use a cold mold surface down to 25 C (80 F). In general, mold surface temperatures lower than 82 C (180 F) may hinder weld line formation and produce a hazy surface or a surface with flow lines, pits and other included defects that can hinder part performance. Postprocessing Postprocessing conditioning and moisturizing are not required. It may be necessary to fixture large or complicated parts with varying wall thickness to prevent warpage while cooling to ambient temperature. Film extrusion Preprocessing Drying is generally not required because Celcon materials are not hydroscopic nor are they degraded by moisture during processing. Excessive moisture can cause surface defects on the extruded film. For better uniformity especially when using regrind or material that has been stored in containers open to the atmosphere, recommended drying conditions are 3 Hrs. at 80 C (180 F). Desiccant hopper dryers are not required. Max. moisture content = 0.35%. Processing Standard extruders with a length to diameter ratio of at least 20:1 are recommended. The screw should be a high compression ratio of at least 3:1 and preferably 4:1 to assure good melting and melt homogeneity. The design should be approximately 35% each for feed and metering sections with the remaining 30% as the transition zone. Printed: 2025-02-13 Page: 3 of 15 Revised: 2024-10-23 Source: Celanese Materials Database CELCON® M90 CELCON® Melt temperature: 160-220 C (320-430 F) Postprocessing Postprocessing conditioning or moisturizing is not required. Other extrusion Preprocessing Drying is generally not required because Celcon materials are not hydroscopic nor are they degraded by moisture during processing. Excessive moisture can cause surface defects. For better uniformity especially when using regrind or material that has been stored in containers open to the atmosphere, recommended drying is 3 hours at 80 C (180 F). Desiccant hopper dryers are not required. Max. moisture content = 0.35% Processing Standard extruders with a length to diameter ratio of at least 20:1 are recommended. The screw should be a high compression ratio of at least 3:1 and preferably 4:1 to assure good melting and uniform melt homogeneity. The design should be approximately 35% each for the feed and metering sections with the remaining 30% as transition zone. Melt temperature 180-220 C (355-430F) Postprocessing Postprocessing conditioning or moisturizing are not required. For thick walled sections (>3mm or 1/8 in.), annealing is recommended to reduce internal
stresses.

Annealing temperature: 130-140 C (265-285 F)

Annealing time: 10 min/mm thickness
Profile extrusion
Preprocessing

Drying is generally not required because Celcon materials are not hydroscopic
nor are they degraded by moisture during processing. Excessive moisture can
cause surface defects on the extrusion. For better uniformity especially when
using regrind or material that has been stored in containers open to the
atmosphere, recommended drying conditions are 3 Hrs. at 80 C (180 F).
Desiccant hopper dryers are not required. Max. moisture content = 0.035%.

Processing

Standard extruders with a length to diameter ratio of at least 20:1 are
recommended. The screw should be a high compression ratio of at least 3:1 and
preferably 4:1 to assure good melting and melt homogeneity. The design should
Printed: 2025-02-13
Page: 4 of 15
Revised: 2024-10-23
Source: Celanese Materials Database
CELCON® M90
CELCON®
be approximately 35% each for feed and metering sections with the remaining
30% as the transition zone.

Melt temperature: 180-220 C (360-430 F).

Postprocessing

Postprocessing or moisturizing is not required. For thick walled extrusions (>3
mm or 1/8 in.), annealing is recommended to reduce internal stresses.

Annealing temperature: 130-140 C (265-285 F)
Annealing time: 10 min/mm thickness
Sheet extrusion
Preprocessing

Drying is generally not required because Celcon materials are not hydroscopic
nor are they degraded by moisture during processing. Excessive moisture can
lead to surface defects. For better uniformity in sheet extrusion especially when
using regrind or material that has been stored in containers open to the
atmosphere, recommended drying is 3 hours at 80 C (180 F). Desiccant hopper
dryers are not required. Max. water content = 0.35%.

Processing

Standard extruders with a length to diameter ratio of at least 20:1 are
recommended. The screw should be a high compression ratio (at least 3:1 and
preferably 4:1) to assure good melting and uniform melt homogeneity. The screw
design should be approximately 35% each for the feed and metering sections
with the remaining 30% as the transition zone.

Melt temperature 180-190 C (355-375 F).

Postprocessing

Postprocessing conditioning or moisturizing is not required. For thick walled
sections (>3mm or 1/8 in.), annealing is recommended to reduce internal
stresses.

Annealing temperature: 130-140 C (265-285 F)

Annealing time: 10 min/mm wall thickness
Blow molding
Preprocessing